[Processing Report] Comparison of Fiber Laser and Semiconductor Laser Welding
Introducing the differences in characteristics between fiber lasers and semiconductor lasers in welding!
This report introduces the differences in the characteristics of welding using fiber lasers (FL) and semiconductor lasers (DDL). Fiber laser welding has a lower laser output and faster processing speed compared to semiconductor laser welding, but it has been confirmed that both achieve approximately the same depth of penetration. By selecting the appropriate laser according to the processing conditions, a wide range of welding can be achieved. 【Characteristics of Fiber Laser Welding】 ■ The beam spot is narrow and the penetration depth is deep. ■ Suitable for cases where deep penetration is required or when laser cutting is desired. ■ Utilizing the small beam spot allows for welding and cutting in narrow spaces or specific areas. *For more details, please refer to the PDF materials or feel free to contact us.
- Company:エンシュウ
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